Fabrication of Copper Clad Aluminum Wire(CCAW) by Indirect Extrusion and Drawing

摘要

The optimized extrusion conditions from the present research were the extrusion temperature of 573～623K and the extrusion ratio(A_0/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3 μm were formed. The electrical conductivity of copper clad aluminum wire was about 70%IACS without annealing.