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Several Problems in the Thermal Contact Resistance Research of Solid Interfaces at Low Temperature

机译:低温固体界面热接触电阻研究中的几个问题

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摘要

According to our experiences in the research of the thermal resistance between solid interfaces at low temperature, some modeling problems such as surface topography, the interface deformation and the improvement of thermal contact of the solid surfaces are introduced in this article. A new thermal contact fractal model is developed. The novel measure equipment is developed which is capable to measure the thermal conductivity and the thermal contact resistance between solid surfaces simultaneously and the test error is analyzed. The experimental results were compared with the prediction data.
机译:根据我们在低温下固体界面之间热阻研究的经验,介绍了一些建模问题,例如表面形貌,界面变形和固体表面热接触的改善。开发了一种新的热接触分形模型。开发了一种新颖的测量设备,该设备能够同时测量固体表面之间的热导率和热接触电阻,并分析测试误差。将实验结果与预测数据进行比较。

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