Photosensitive Polyimide Based on Poly(amic acid) and Thermal Imidization at 200℃ with Photo-Base Generator

摘要

The negative-type PSPI was formulated from the polymerization solution of PAA with the photo-base generator (PBG). The photosensitivity and contrast of the resist film consisting of PAA(1) and DNCDP (85/15 wt/wt) in 1.0 μm thickness showed 220 mJ/cm~2 and 11.7, respectively. A clear negative-tone image with 8-μm feature was produced from that of PAA(1) and DNCDP (75/25 wt/wt), and subsequently converted into the corresponding PI(1) pattern upon the heating at 200℃. This new patterning and imidization chemistry will provide a potentially efficient and versatile route for PSPIs.