MULTICHIP MODULES OF 3-D ASSEMBLING ON UNPACKED VLSI FOR ON-BOARD SPACE RADIOELECTRONIC SYSTEMS

摘要

The purpose of this paper is lower overall dimensions and mass of electronic modules used in on-board space systems, higher integration and reliability, including radiation resistance, as well as higher speed. This paper presents structural and technological principles and results of their realization in developing of small-sized multichip electronic modules for onboard radio-electronic systems using unpacked VLSI and flexible polyimide bearers. Flexible polyimide bearers are used integration of crystals of VLSI chips and their testing, validation and futher microassembling onto multilayer 3D switching boards, as well as for creation of flexible precise loops and multilayer switching boards with beam-leads.