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Modeling and model parameter extraction of wide bandgap power semiconductor device, package, and circuit for simulating fast switching behavior

机译:用于模拟快速开关行为的宽带隙功率半导体器件,封装和电路的建模和模型参数提取

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Wide band gap power semiconductor devices have superiority in fast switching operation, when compared to Si IGBT and PiN diodes for voltage range from several hundred to several kilo volts. The fast switching operation gives high di/dt and dv/dt, which results in inducing surge voltage and EMI noise for poorly designed circuit. The precise dynamical model of power device and peripheral component is necessary in estimating these transient phenomenon. This paper presents the dynamical model of wide bandgap power semiconductor devices, package of power device, and circuit wiring. The fixture configurations to extract model parameter is also presented. The static blocking and conducting condition for power device is characterized with curve tracer. The terminal capacitance of power device dominates switching dynamic characteristics. Then, voltage dependency of terminal capacitances are characterized with the developed fixture, which can cope with normally on transistor characterization. The electro magnetic analysis of package and circuit to identify parasitic component is also addressed in the paper. The switching behaviors of power device and the phenomenon in the circuit are discussed based on the model and extracted model parameters.
机译:与Si IGBT和PiN二极管相比,宽带隙功率半导体器件在几百伏到几千伏的电压范围内具有快速开关操作的优势。快速开关操作会产生高di / dt和dv / dt,这会导致设计不良的电路产生浪涌电压和EMI噪声。在估算这些瞬态现象时,需要功率器件和外围组件的精确动力学模型。本文介绍了宽带隙功率半导体器件,功率器件的封装和电路布线的动力学模型。还介绍了提取模型参数的夹具配置。用曲线跟踪仪对电力设备的静态闭锁和导电状态进行了表征。功率器件的端电容主导着开关动态特性。然后,使用开发的夹具对端子电容的电压依赖性进行表征,该夹具可以正常应对晶体管的表征。本文还讨论了封装和电路的电磁分析,以识别寄生元件。基于模型并提取模型参数,讨论了功率器件的开关行为和电路中的现象。

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