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Crosstalk and delay analysis in Multi-Walled Carbon Nanotube and Single-Walled Carbon Nanotube Interconnects

机译:多壁碳纳米管和单壁碳纳米管互连中的串扰和延迟分析

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In this Paper a comparative analysis between Single-Walled Carbon Nanotube (SWCNT) and Multi-Walled Carbon Nanotube (MWCNT) Bundle interconnects is established. In first place, an Aggressor-Victim model (based on a carbon nanotube equivalent circuit conductor) was carried out to examine the effect of crosstalk and delay in MWCNT bundles. The Aggressor-Victim model was simulated in Pspice taking in consideration tree values of interconnect length: 1, 10 and 50 μm. the performance in terms of crosstalk values and the induced delay in MWCNT bundles is simulated on the basis electrical parameters of Carbon Nanotube interconnects for the 32nm technology node at an ambient temperature. A similar analysis is performed for the SWCNT bundle interconnects and compared with MWCNT bundle interconnects.
机译:本文建立了单壁碳纳米管(SWCNT)和多壁碳纳米管(MWCNT)束互连之间的比较分析。首先,进行了Aggressor-Victim模型(基于碳纳米管等效电路导体)来检查MWCNT束中的串扰和延迟的影响。考虑到互连长度为1、10和50μm的树值,在Pspice中模拟了Aggressor-Victim模型。在环境温度下,基于32nm技术节点的碳纳米管互连的电学参数,模拟了MWCNT束中串扰值和感应延迟方面的性能。对SWCNT束互连进行了类似的分析,并与MWCNT束互连进行了比较。

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