Zero Insertion Force MEMS Socket: 3d Multi-Chip Assembly for Microrobotics

摘要

This paper presents an innovative approach for 3D multi-chip assembly using a zero insertion force (ZIF) MEMS socket, which was designed, fabricated and tested. We demonstrate: 1) 3D assembly between a ZIF socket and a linear MEMS motor, 2) 3D assembly between a socket and a microrobotic leg, and 3) resistance versus force data for probes coated with various metals, to characterize the electrical connections between the ZIF socket and the inserted chip. Potential applications for this work include microrobotics assembly (MEMS-MEMS) and probe cards for effortless testing of and 3D assembly with CMOS chips (MEMS-CMOS).