Micro Heat Sink Structure with High Thermal Conductive Composite via Micromachining Process

摘要

A novel micro heat sink structure (pin fins) integrated with high thermal conductive Cu-diamond composites via micromachining process is reported. The thermal conductivity of Cu-diamond composites are 450.21 W/m K reinforced with 325/400 diamond and 614.87 W/m K reinforced with 140/170 diamond, respectively, stemming to the perfect interfaces between diamond and copper. As such, this work presents a promising approach to synthesized high thermal conductive Cu-diamond composites material and its application in microchannel pin fins.