Tactile Sensing From Backside of Flexible Printed Circuit Using LSI-Integrated Sensor with Elastic Dome Structure

摘要

This paper presents a new configuration of CMOS-LSI integrated tactile sensor flip-chip-bonded on a flexible printed circuit (FPC) in a standard face-down manner. The tactile sensors receive force from the backside of the FPC through an elastic dome structure. Device layer transfer process using fly-cut planarized metal bonding technology was developed for the LSI-MEMS integration. The fabrication of this configuration is much easier than that of the previous one, where an LSI-integrated sensor is connected to the FPC in a face-up manner via through-silicon vias (TSVs) in the LSI. In addition, the sensitivity of the integrated sensor can be adjusted by optimizing elastic modulus of a dome structure, which is made by molding. Finally, the operation of the total system was successfully confirmed.