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Characterization of Orientation-Dependent Etching Properties and Surface Morphology of Sapphire Crystal in Wet Etching

机译:蓝宝石晶体湿法刻蚀中取向依赖的刻蚀特性和表面形态的表征

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Sapphire crystal is extensively used in fabrication of advanced micro/nano devices. Due to its crystalline structure, sapphire shows more complicated properties in wet etching process. This paper for the first time investigates the measurement of the overall orientation dependence of the etch rate for sapphire under different etchant. The experiment shows that sapphire crystal has six high etch rate regions in etch rate distribution, which is quite different from other trigonal crystal materials. The change in surface morphology also strongly depends on the crystallographic orientation. We demonstrate etch rate distribution and texture of morphology as a function of orientation. The overall etch rate distribution successfully explains the transient and stable structural facets appearing on the sidewalls of trenches, cavities, mesas and complex structures during anisotropic etching, which is essential for the applications such as patterned sapphire substrates (PPS).
机译:蓝宝石晶体广泛用于先进的微/纳米器件的制造中。由于其晶体结构,蓝宝石在湿法蚀刻工艺中显示出更复杂的特性。本文首次研究了在不同蚀刻剂下蓝宝石蚀刻速率的整体取向依赖性的测量。实验表明,蓝宝石晶体在蚀刻速率分布中具有六个高蚀刻速率区域,这与其他三角晶体材料完全不同。表面形态的变化也强烈取决于晶体学取向。我们展示了蚀刻速率分布和形态结构作为取向的函数。总体蚀刻速率分布成功地解释了各向异性蚀刻过程中出现在沟槽,空腔,台面和复杂结构的侧壁上的瞬态和稳定结构刻面,这对于图案化蓝宝石衬底(PPS)等应用至关重要。

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