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Fabrication and Characterization of Carbon Nanotube Microdevices for CO

机译:碳纳米管微器件的制备与表征

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/Si and glass substrate. The metal film of 200 nm thickness is deposited on the substrate with an electron beam evaporation system. The minimum space between the electrodes is found to be 3 μm. The circular interdigitated metal electrodes have a larger area in comparison to the other types of interdigitated electrodes structures. Further, we fabricate Au NPs decorated SWNT-based devices with interdigitated electrodes. The fabricated devices show a good response to CO
机译:/ Si和玻璃基板。用电子束蒸发系统将200 nm厚的金属膜沉积在基板上。电极之间的最小间距为3μm。与其他类型的叉指状电极结构相比,圆形叉指状金属电极具有更大的面积。此外,我们制造了带有交叉电极的金纳米粒子修饰的基于SWNT的器件。制成的器件显示出对CO的良好响应

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