An Intelligent Extraction Tool for Chip-Package-Board Structures with 3D Full-Wave Accuracy

机译：具有3D全波精度的芯片封装板结构智能提取工具

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摘要

An intelligent 3D full-wave extraction tool for chip, package, and board-layout structures has been developed with proven accuracy from near DC to high GHz range on realistic layouts. The tool is constructed based on finite element modeling with an adaptive mesh refinement. This tool is ready to be used by inputting complicated layout files and outputting S and Z parameters with minimum user operations.

机译：已经开发出了一种用于芯片，封装和电路板布局结构的智能3D全波提取工具，其经过验证的精度在逼真的布局上具有从近DC到高GHz范围的精度。该工具是基于有限元建模和自适应网格细化而构建的。通过输入复杂的布局文件并以最少的用户操作输出S和Z参数，即可使用此工具。

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来源
《International Conference on Computational Electromagnetics》|2018年|1-3|共3页
会议地点 Chengdu(CN)
作者
Qing He; Rui Nan Chang; Mei Song Tong;
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作者单位

Department of Electronic Science and Technology Tongji University Shanghai 201804 China;

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关键词
Tools; Layout; Finite element analysis; Geometry; Three-dimensional displays; Scattering parameters; Insertion loss;

机译：工具；布局;有限元分析;几何;三维显示器；散射参数插入损耗;

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An Intelligent Extraction Tool for Chip-Package-Board Structures with 3D Full-Wave Accuracy

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