Thermal/Acoustic trade-off design for ConsumerElectronics in a distributed design environment

摘要

Today's market demand for smaller, more powerful consumer electronics posesrna major challenge to the rapid design of products. In addition, the ability to perform strategicrncoordination amongst different stakeholders within the enterprise increasingly becomes anrnimportant criterion to enable global engineering. We begin the paper with an introduction to arntypical design process involving distributed design teams In particular the process allows thernthermal-acoustic design of cavities, I.e. Air space inside the enclosure, in terms of flow rate andrnacoustic radiation resistance. Then we proceed with the investigation of an approachrnleveraging recent modelling technology to support such a process efficiently. The processrnmakes use of the system modelling language (SysML.) as product description support and thernDesign Structure Matrix as an analytical design tool. We use the model and the DSM as arnmeans to drive numerical simulation and perform trade-off studies .Simulation results showrnthat performing trade-off study in the early system design phase leads to a potentially optimalrnmodule layout for the problem studied.