High-performance Broadband and High Frequency Interconnect Designs for RF Coaxial Connector to Multilayer Ceramic Package Transitions

摘要

This paper presents and discusses optimized coaxial connector-to-multilayer ceramic substrate transition designs for selected commercial off-the-shelf high frequency broadband RF connectors. We show that broadband performance out to 50 GHz is readily achievable for edge connector configurations with standard microwave design practices. For sidewall and broadwall connector-topackage configurations, extended substrate manufacturing design rules typically allow broadband performance to about 20 GHz. For the broadwall connector-to-package transition a new connector concept is presented. It is shown that broadband high frequency performance can be achieved up to 30 GHz by designing the connector pin and housing with controlled impedance methods. Simulated and correlated measurements up to 30 GHz are presented for this new connector design. With advanced substrate processes, in addition to the modified pin and connector housing, we propose a new pin attach method having simulated results demonstrating potential performance up to 40 GHz for the broadwall RF connector-to-substrate transition.