Research on Cleaning and Drying Process of Quartz Wafer based on Orthogonal Experiment

摘要

The insulation impedance resistance value is the decisive factor to realize the "quasi static" measurement by the multidimensional piezoelectric force sensor. In order to improve the insulation impedance of the quartz wafer, the sources of contamination and the impact on measurement performance are analyzed. By analyzing and comparing the existing cleaning methods on the quartz wafer surface, three kinds clearing methods on the quartz wafer are designed. The cleaning process of quartz wafers is made. The drying technology of quartz crystal is studied. Finally, the insulation impedance resistance test is designed and carried out. The main factors which affect the impedance of the insulation are analyzed. The optimum selection of cleaning temperature, drying time and cleaning method is obtained through orthogonal test. This paper provides an important reference for the piezoelectric sensor to realize high impedance quartz chip for quasi-static measurement.