Characteristics of thin-film devices for a stack-type MCM

摘要

A stack-type multichip module (MCM) or CUBIC (cumulative bondedIC) is proposed. The CUBIC is composed of thin-film device layers thatare only a few micrometers thick stacked vertically and connectedelectrically. It has short chip-to-chip interconnections and a smallmodule size. The characteristics of the thin-film devices are reportedas a function of polished silicon layer thickness