Electrical analysis of a thin film multichip module substrate

摘要

Several related technologies are required to design andmanufacture a successful multichip module product. Technology selectiondepends on how certain parameters are weighted. Decision parametersinclude module size, number of input/output signals, performance, power,ambient temperature environment, availability of semiconductors otherthan wirebond-compatible, and cost. The authors describe the electricalanalysis performed on a 6-chip evaluation module designed and builtwithin Motorola. Results of the module electrical analysis are comparedwith estimates of the same circuit function built with single chippackages on a printed circuit board