Silicon-on-silicon technology for CMOS-based computer systems

摘要

The main features of Si-on-Si technology are outlined. Theelectrical design of the wiring substrate is described, and chipconnection and thermal design issues are addressed. Several options formechanically supporting a large Si substrate are considered. A digitalsignal processing module developed using chip-on-wafer technology isdiscussed as an example. AlN ceramic was found to be an excellentpackaging material to mechanically support a large Si substrate withhigh reliability