Technology and Application of 3D Interconnect

摘要

3D interconnection offers a number of advantages for system integration over other techniques such as system-on-chip and system-in-package. In many situations 3D integration can offer the interconnect performance associated with system on chip while allowing the process differentiation of system in package. However, 3D integration does require a number of new process technologies which are the subject of substantial research. Additionally, 3D interconnection introduces new design challenges and opportunities.