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In-depth Analysis of 4T SRAM Cells in Double-Gate CMOS

机译:双门CMOS中的4T SRAM单元的深入分析

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This paper presents a whole study of sub-32 nm CMOS 4T SRAM cells in fully depleted (FD) double-gate (DG) silicon-on-insulator (SOI) technology with planar independent self-aligned gates. Both independent- and connected-gate operation is analyzed either with symmetrical or asymmetrical transistors which have been adjusted according to the current process possibilities. An improved 4T driverless (DL) SRAM cell is proposed and compared with a 4T loadless (LL). Both cells take advantage of the back gate to improve stability in read and retention mode by using a feedback between access transistor and opposite storage node. A set of criteria have been analyzed for an efficient characterization of read-, retention- and write margins, power and access time. Typical and worst cases have been computed to assure operating margins in presence of accurate process variation.
机译:本文介绍了采用平面独立自对准栅极的完全耗尽(FD)双栅极(DG)绝缘体上硅(SOI)技术中的32 nm以下CMOS 4T SRAM单元的完整研究。可以根据当前工艺可能性对对称或不对称晶体管进行分析,以分析独立栅极操作和连接栅极操作。提出了一种改进的4T无驱动器(DL)SRAM单元,并将其与4T无负载(LL)进行了比较。两个单元都利用背栅的优势,通过使用访问晶体管和相对存储节点之间的反馈来提高读取和保留模式下的稳定性。已经分析了一组标准,以有效表征读取,保留和写入裕量,功耗和访问时间。已计算出典型和最坏的情况,以确保在存在准确的过程变化的情况下保证运行裕量。

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