Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate

机译：有机包装基板无源元件的嵌入式工艺开发和特性分析

获取原文

获取外文期刊封面目录资料

页面导航

摘要
著录项
引文网络
相似文献
相关主题

摘要

Operating frequency and speed growth rapidly today, 3C product demand more light, thin and small that can easily to bring anywhere. That''s mean more complex IC package architecture and high performance substrate design to place maximum amount of passives

机译：如今，随着工作频率和速度的快速增长，3C产品要求更轻，更薄，更小，可以轻松带到任何地方。这意味着需要更复杂的IC封装架构和高性能基板设计来放置最大数量的无源器件

著录项

来源
《Electron Devices and Solid- State Circuits, 2007 IEEE Conference on》|2007年|P.1055-1057|共3页
会议地点 TainanTaiwan
作者
Yu-Che Tai; Chi-Chang Lai; Sung-Mao Wu; Jahja; E.; Jui-Wen Wang;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类
关键词
capacitors; integrated circuit packaging; passive networks; substrates; 3C product demand; Ansoft 3D full wave EM solver; IC package architecture; characterization analysis; discrete capacitor; embedded capacitor technology; embedded process development; high frequ;

机译：电容器;集成电路封装；无源网络；基材3C产品需求； Ansoft 3D全波电磁求解器； IC封装架构；特征分析；分立电容器嵌入式电容器技术；嵌入式过程开发；高频率;

相似文献

外文文献
中文文献
专利

1. Highly reliable processes for embedding discrete passive components into organic substrates [J] . Han Seo Cho, Sukhyeon Cho, Jihong Jo, Microelectronics reliability . 2008,第5期

机译：将离散的无源组件嵌入有机衬底的高度可靠的过程
2. FULLY EMBEDDED LC DIPLEXER PASSIVE CIRCUIT INTO AN ORGANIC PACKAGE SUBSTRATE [J] . Hwan Hee Lee, Jae Yeong Park Microwave and optical technology letters . 2007,第12期

机译：完全嵌入LC双工器无源电路的有机包装基质
3. Fabrication and Characterization of Embedded Passive Components for Low Cost Organic RF SOP Applications [J] . Hwan H. Lee, Seung J. Lee, Jae Y. Park Integrated Ferroelectrics . 2006,第1期

机译：用于低成本有机RF SOP应用的嵌入式无源元件的制造与表征
4. Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate [C] . Yu-Che Tai, Chi-Chang Lai, Sung-Mao Wu, IEEE Conference on ELectron Devices and Solid-State Circuits . 2007

机译：有机包装基板无源部件的嵌入式工艺开发和表征分析
5. Compact RF/microwave passive components and modules on multilayer organic substrates. [D] . Ta, Hai Hoang. 2012

机译：在多层有机基板上的紧凑型RF /微波无源组件和模块。
6. High‐Volume Processed ITO‐Free Superstrates and Substrates for Roll‐to‐Roll Development of Organic Electronics [O] . Markus Hösel, Dechan Angmo, Roar R. Søndergaard, 2014

机译：大批量加工无ITO的基板和用于有机电子滚动开发的基板
7. Experimental Analysis of the Water Absorption Effects on RF/mm-Wave Active/Passive Circuits Packaged in Multilayer Organic Substrates [O] . Dane C. Thompson, Manos M. Tentzeris, Senior Member, 2008

机译：多层有机基质中射频/毫米波有源/无源电路吸水效应的实验分析
8. Development of chemical analysis techniques for organic components in processing solutions. Final report [R] . Smith, R E 1992

机译：开发处理溶液中有机组分的化学分析技术。总结报告

Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate

摘要

著录项

引文网络

相似文献

相关主题

期刊订阅