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Wide-Bandgap Semiconductor Devices for Automobile Applications

机译:汽车应用的宽带隙半导体器件

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摘要

In this paper, we discuss requirements of power devices for automobile applications, especially hybrid vehicles, and the development of GaN power devices at Toyota. We fabricated AlGaN/GaN HEMTs and measured their characteristics. The breakdown voltage was over 600V. The drain current with a gate width of 31mm was over 8A. Observation by a thermograph image of the device under high current operation showed the AlGaN/GaN HEMT operated at more than 300℃. All the results of our GaN are really promising to realize high performance and small size inverters for future automobiles.
机译:在本文中,我们讨论了汽车应用(尤其是混合动力汽车)对功率器件的要求,以及丰田公司GaN功率器件的发展。我们制造了AlGaN / GaN HEMT,并测量了它们的特性。击穿电压超过600V。栅极宽度为31mm的漏极电流超过8A。通过在大电流操作下的器件的热像图观察,可以看出AlGaN / GaN HEMT的工作温度超过300℃。我们的GaN的所有结果确实有望为未来的汽车实现高性能和小尺寸的逆变器。

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