Reversible Wafer Bonding; Challenges in Ramping up 150mm GaAs Wafer Production to Meet Growing Demand

摘要

At Filtronic Compound Semiconductors' 150mm gallium arsenide wafer fab in Newton Aycliffe a reversible wafer bonding process has been developed to accommodate a significant increase in wafer production through the backend processes. This method of mounting and demounting wafers from sapphire substrates has produced mechanical and visual yield exceeding 99% while demonstrating process capability for wafer thinning > 1.7 CpK. This paper will discuss the process development for wafer bonding and de-bonding in a volume-manufacturing environment along with the challenges experienced with rapid growth in wafer demand.