Semiconductor Innovation and Integration Drives Next-Generation 3G Multimedia Devices

机译：半导体创新与集成推动下一代3G多媒体设备

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摘要

The author describes powerful new integration strategies and techniques that will continue to propel us toward even more exciting products and applications.

机译：作者介绍了强大的新集成策略和技术，这些策略和技术将继续推动我们向更令人兴奋的产品和应用程序发展。

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来源
《Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20060425-27; Vancouver(CA)》|2006年|P.15-17|共3页
会议地点 Vancouver(CA)
作者
Brian Daly;
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作者单位

Skyworks Solutions Inc., 5221 California Avenue, Irvine, CA 92617, USA;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体技术;
关键词
SPR; SiP; SoC; packaging and integration;

机译：SPR; SiP; SoC;封装和集成;

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2. Licence to (integrate) drives - Can Foundation Fieldbus integrate with motors and drives as end devices? [J] . IAN VERHAPPEN Manufacturing automation: Machine Dessig, Systems, Technology . 2008,第4期

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3. Freescale Unveils Next-Generation i.MX Processor for Portable Multimedia Devices [J] . John Donovan Portable Design: The Engineer's Resource for Portable Applications . 2008,第6期

机译：飞思卡尔推出适用于便携式多媒体设备的下一代i.MX处理器
4. Semiconductor Innovation and Integration Drives Next-Generation 3G Multimedia Devices [C] . Brian Daly Annual International Conference on Compound Semiconductor MANufacturing TECHnology . 2006

机译：半导体创新和集成驱动下一代3G多媒体设备
5. Molecular Beam Epitaxy Integration of Magnetic Ferrites with Wide Bandgap Semiconductor 6Hydrogen-Silicon carbide for Next-generation Microwave and Spintronic Devices [D] . Cai, Zhuhua 2010

机译：磁性铁氧体与宽带隙半导体6H-碳化硅的分子束外延集成，用于下一代微波和自旋电子器件
6. Annual Conference Supplement 2008: Prior conceptions of integration and coordination as modulators of an innovations adoption: the case of a pilot project targeting the implementation of a services integration device in France [O] . Y. Couturier, H. Trouvé, D. Gagnon, 2008

机译：2008年年度会议补编：整合和协调作为创新采用的调节器的先前概念：针对法国实施服务集成设备的试点项目
7. Prediction and Validation of Wear-Out Reliability Metrics for Power Semiconductor Devices With Mission Profiles in Motor Drive Application [O] . Ke Ma, Ui-Min Choi, Frede Blaabjerg 2018

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Semiconductor Innovation and Integration Drives Next-Generation 3G Multimedia Devices

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