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A New Alkaline CN-Free Silver Process for Electronic, Industrial Decorative Plating Applications

机译:电子,工业和装饰电镀应用的新型碱性无CN银工艺

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摘要

A new CN-free silver plating process that can be utilized in barrel and rack applications has been in production use for more than a year. A discussion on the bath parameters, plating characteristics and the properties of the silver plate will be presented. Platers who are currently using this process have found it to be easy to operate and say it has many advantages over other alkaline CN-free silver plating processes. It offers brilliant white color, very stable chemistry, and a wide operating window. Some platers have even found advantages over CN-silver plating processes. By switching to this process, the plater can meet requirements of EPA's Common Sense Initiative by eliminating or reducing their cyanide use, which would lower the plater's hazardous waste.
机译:可以在桶和机架应用中使用的一种新的无CN镀银新工艺已经投入生产使用了一年多。将讨论镀液参数,镀层特性和银板的性能。当前正在使用该工艺的电镀商发现它易于操作,并说与其他无碱无CN的银电镀工艺相比,它具有许多优势。它具有鲜艳的白色,非常稳定的化学性质和宽广的操作范围。一些电镀商甚至发现了比CN-银电镀工艺更优越的条件。通过切换到此过程,通过消除或减少氰化物的使用,可以降低电镀工人的有害废物,从而满足EPA常识计划的要求。

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