首页> 外文会议>Advances in Resist Technology and Processing XXIV pt.2; Proceedings of SPIE-The International Society for Optical Engineering; vol.6519 pt.2 >Novel Polymeric Anionic Photoacid Generators (PAGs) and Photoresists for sub-100 nm Patterning by 193 nm Lithography
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Novel Polymeric Anionic Photoacid Generators (PAGs) and Photoresists for sub-100 nm Patterning by 193 nm Lithography

机译:用于193 nm光刻的亚100 nm图案化的新型聚合物阴离子光酸产生剂(PAG)和光致抗蚀剂

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摘要

A series of new anionic PAGs, as well as PAG bound polymers designed for use in 193 nm photoresist materials have been synthesized and characterized. These novel materials provide optical transparency at 193 nm and also etch resistance. The fluorine substituted PAG bound polymer and PAG blend resist provided 110 nm (220 nm pitch) line/space at 11.5, 13.0 mJ/cm~2, and 80 nm isolated features at 3, 1 mJ/cm~2, respectively. The LER (3a) results showed the fluorinated PAG bound polymer have LER values 6.7 nm and 6.8 nm for isolated 80 nm and dense 110 nm lines respectively, which were lower than the PAG Blend polymers.
机译:已合成和表征了一系列新的阴离子PAG以及设计用于193 nm光致抗蚀剂材料的PAG键合的聚合物。这些新颖的材料可提供193 nm的光学透明度以及抗蚀刻性。氟取代的PAG粘合的聚合物和PAG共混抗蚀剂分别在11.5、13.0 mJ / cm〜2和3、1 mJ / cm〜2的情况下提供110 nm(220 nm间距)的线/间距和80 nm的隔离特征。 LER(3a)结果表明,与孤立PAG共混聚合物相比,氟化PAG键合聚合物的LER值分别为6.7 nm和6.8 nm(对于孤立的80 nm和110 nm密集线)。

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