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Study of dynamical formation and shape of microlenses formed by the reflow method

机译:回流法形成微透镜的动力学形成和形状研究

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Microlenses arrays are commonly used in CMOS images sensors to focus the incident light onto the photosensitive area of the pixel. These microlenses are fabricated using a thermal reflow method. Currently, due to the fast evolution of CMOS Imager technology, the understanding of the mechanisms involved in microlens formation becomes essential to better control what occurs during the process. We have seen in a previous study that the complexity of the reflow method comes from the competition between two phenomena occurring during the melt bake step: on one hand the surface tension tends to push the resist patterns into a spherical shape, on the other hand the resist crosslinking reaction drastically increases the resist viscosity hindering the microlens formation. In this paper the influence of resist crosslinking, resist volume and resist/substrate interface on the final shape of the microlens has been investigated. It appears that the contact angle between microlens and substrate varies depending on substrate wettability but is the same whatever the resist volume for a given substrate/resist combination. The microlens shape depends also significantly on bake temperature and crosslinking kinetics. In fact the right tuning of process conditions seems to be the key parameter in the control of the final microlens shape because it enables to adjust the kinetics of each mechanism and thus favour the microlens formation with regards to resist crosslinking.
机译:微透镜阵列通常用于CMOS图像传感器中,以将入射光聚焦到像素的感光区域上。这些微透镜是使用热回流法制造的。当前,由于CMOS成像器技术的快速发展,对微透镜形成所涉及的机制的理解对于更好地控制过程中发生的事情变得至关重要。我们在先前的研究中已经看到,回流方法的复杂性来自熔体烘烤步骤中发生的两种现象之间的竞争:一方面,表面张力趋于将抗蚀剂图案推成球形,另一方面,抗蚀剂交联反应极大地增加了抗蚀剂粘度,阻碍了微透镜的形成。在本文中,研究了抗蚀剂交联,抗蚀剂体积和抗蚀剂/基材界面对微透镜最终形状的影响。看起来微透镜与基板之间的接触角根据基板的润湿性而变化,但是对于给定的基板/抗蚀剂组合,无论抗蚀剂体积如何,该角度都是相同的。微透镜的形状还很大程度上取决于烘烤温度和交联动力学。实际上,正确调节工艺条件似乎是控制最终微透镜形状的关键参数,因为它可以调节每种机理的动力学,从而在抵抗交联方面有利于微透镜的形成。

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