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Optimization of Process Parameters Based on Multi-process and Multi-evaluation Index for Function Ceramics in CMP

机译:基于多工艺和多评价指标的CMP功能陶瓷工艺参数优化

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摘要

To enhance polishing quality,polishing efficiency and improve the backward state based on single-process way for function ceramics in CMP,a new optimization method of process parameters based on multi-process and multi-evaluation theory is put forward.Firstly,based on experimental data obtained from orthogonal experiment,the optimal combinations of process parameters are got separately in term of surface roughness and material removal rate,which is optimized by Taguchi method in each process.Secondly,combining analysis of evaluation index weight ratio with analysis of variance,the final optimal combination of process parameters is received under the integrated evaluation of surface roughness and material removal rate.Finally,the contrast verification results show that the proposed optimization method is effective.
机译:为了提高抛光质量,抛光效率并改善CMP中功能陶瓷的单工艺方法,提出了一种基于多工艺和多评价理论的工艺参数优化新方法。通过正交试验得到的数据,分别根据表面粗糙度和材料去除率分别获得工艺参数的最佳组合,并通过田口法在各个工艺中进行优化。其次,将评价指标权重比分析与方差分析相结合,在表面粗糙度和材料去除率的综合评价下,获得了工艺参数的最终最优组合。最后,对比验证结果表明所提出的优化方法是有效的。

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