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Source polarization and OPC effects on illumination optimization

机译:源偏振和OPC对照明优化的影响

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To perform a thorough source optimization during process development is becoming more critical as we move to leading edge-technology nodes. With each new node the acceptable process margin continues to shrink as a result of lowering k1 factors. This drives the need for thorough source optimization prior to locking down a process in order to attain the maximum common depth of focus (DOF) the process will allow. Optical proximity correction (OPC) has become a process-enabling tool in lithography by providing a common process window for structures that would otherwise not have overlapping windows. But what effect does this have on the source optimization? With the introduction of immersion lithography there is yet another parameter, namely source polarization, that may need to be included in an illumination optimization process. This paper explored the effect polarization and OPC have on illumination optimization. The Calibre ILO (Illumination Optimization) tool was used to perform the illumination optimization and provided plots of DOF vs. various parametric illumination settings. This was used to screen the various illumination settings for the one with optimum process margins. The resulting illumination conditions were then implemented and analyzed at a full chip level. Based on these results, a conclusion was made on the impact source polarization and OPC would have on the illumination optimization process.
机译:随着我们转向尖端技术节点,在过程开发过程中执行全面的源优化变得越来越重要。对于每个新节点,由于降低k1因子,可接受的工艺裕度将继续缩小。因此,在锁定过程之前,需要进行彻底的源优化,以便获得过程所允许的最大公共焦点深度(DOF)。通过为否则将不具有重叠窗口的结构提供公共的处理窗口,光学邻近校正(OPC)已成为光刻中的一种使工艺成功的工具。但是,这对源优化有什么影响?随着浸没式光刻技术的引入,可能需要在照明优化过程中包括另一个参数,即源偏振。本文探讨了偏振和OPC对照明优化的影响。 Calibre ILO(照明优化)工具用于执行照明优化,并提供了DOF与各种参数照明设置的关系图。这用于筛选具有最佳工艺裕量的各种照明设置。然后在整个芯片级别上实施和分析所得的照明条件。基于这些结果,得出了关于冲击源极化和OPC对照明优化过程的结论。

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