首页> 外文会议>25th Annual BACUS Symposium on Photomask Technology pt.1 >Process Window Impact of Progressive Mask Defects, its Inspection and Disposition Techniques (go / no-go criteria) via a Lithographic Detector
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Process Window Impact of Progressive Mask Defects, its Inspection and Disposition Techniques (go / no-go criteria) via a Lithographic Detector

机译:渐进式掩模缺陷的工艺窗口影响,其检查和处置技术(通过/不通过标准)通过光刻检测器

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Progressive mask defect problem is an industry wide mask reliability issue. During the start of this problem when the defects on masks are just forming and are still non-critical, it is possible to continue to run such a problem mask in production with relatively low risk of yield impact. But when the defects approach more critical state, a decision needs to be made whether to pull the mask out of production to send for clean (repair). As this problem increases on the high-end masks running DUV lithography where masks are expensive, it is in the interest of the fab to sustain these problem masks in production as long as possible and take these out of production only when absolutely necessary; i.e., when the defects have reached such a critical condition on these masks that it will impact the process window. During the course of this technical work, investigation has been done towards understanding the impact of such small progressive defects on process window. It was seen that a small growing defect may not print at the best focus exposure condition, but it can still influence the process window and can shrink it significantly. With the help of a high-resolution direct reticle inspection, early detection of these defects is possible, but fabs are still searching for a way to disposition (make a go / no-go decision) on these defective masks. But it is not an easy task as the impact of these defects will depend on not only their size, but also on their transmission and MEEF. A lithographic detector has been evaluated to see if this can predict the criticality of such progressive mask defects.
机译:渐进式掩模缺陷问题是行业范围内的掩模可靠性问题。在这个问题的开始期间,当掩模上的缺陷刚刚形成并且仍然不很严重时,可以在生产中以相对较低的良率影响风险继续运行这样的问题掩模。但是,当缺陷接近更严重的状态时,需要决定是否将掩膜从生产中拉出以进行清洁(修理)。由于在使用昂贵的掩模进行DUV光刻的高端掩模上,这一问题日益严重,因此,为了使制造中的问题掩模在生产中保持尽可能长的时间,并仅在绝对必要时才将其停产,这符合晶圆厂的利益。即,当缺陷在这些掩模上达到如此严重的条件时,它将影响工艺窗口。在这项技术工作的过程中,已经进行了调查,以了解这种小的渐进缺陷对过程窗口的影响。可以看出,在最佳的聚焦曝光条件下,可能无法打印出一个小的生长缺陷,但仍会影响工艺窗口并使其显着缩小。借助高分辨率的直接掩模版检查,可以尽早发现这些缺陷,但晶圆厂仍在寻找在这些有缺陷的掩模上进行处理(通过/不通过的决定)的方法。但这不是一件容易的事,因为这些缺陷的影响不仅取决于它们的大小,还取决于它们的传播和MEEF。已经对光刻检测器进行了评估,以查看其是否可以预测此类渐进式掩模缺陷的严重性。

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