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Glass Ball Grid Array Arrangement and Characterization for Capacitive Proximity Sensor

机译:电容式接近传感器的玻璃球网格阵列布置和特性

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摘要

In this paper, we proposed a novel capacitive sensor. It was constituted by the parallel enameled copper wires as the electrodes. This sensor can be used to detect the yield ratio of micro assembled glass ball grid array (GBGA). The vacancy of the GBGA causes the capacitance drop, so we can detect the yield ratio of the micro-assembly process of GBGA by monitoring the change of the capacitance. Additionally, we measured the capacitance variation of the relative displacement about the copper wires and the GBGA in longitudinal and transverse directions. The measurements of capacitance variation in longitudinal relative displacement have stepwise features. These features have not been seen in other capacitive proximity sensors.
机译:在本文中,我们提出了一种新颖的电容传感器。它由平行的漆包铜线作为电极组成。该传感器可用于检测微型组装的玻璃球栅阵列(GBGA)的成品率。 GBGA的空位会导致电容下降,因此我们可以通过监视电容的变化来检测GBGA的微装配工艺的成品率。此外,我们测量了铜线和GBGA沿纵向和横向的相对位移的电容变化。纵向相对位移中电容变化的测量具有逐步特征。这些功能尚未在其他电容式接近传感器中看到。

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