Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan;
adhesive bonding; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; polymers; silicon; substrates; three-dimensional integrated circuits; 3D integration technoology; SU-8 polymer sealing bonding structure; advanced crystal component package; advanced silicon-based substrate; ceramic-based substrate; integrated circuit fabrication; integrated circuit manufacture; metal lid; semiconductor technique; silicon TSV interposer substrate; silicon-based crystal component package;
机译:一种新型的中介层的制造和电学特性,该中介层具有用于2.5D / 3D应用的具有超低电阻率的直通硅通孔(TSV)的聚合物衬里和硅柱
机译:通过硅通孔(TSV)的晶片级封装(WLP)的射频(RF)性能研究RF-MEMS和微机械波导在5G和物联网(物联网)的情况下集成(IOT)应用:部分 1验证3D建模方法
机译:TSV(硅通孔)对3D IC集成系统级封装(SiP)的热性能的影响
机译:先进的水晶元件封装,采用3D集成和新型SU-8聚合物密封粘合结构的硅TSV插入器
机译:通过低温芯片对晶圆键合将铟镓砷MSM阵列与硅平台进行3D集成。
机译:石英谐振器与TSV中介层通过聚合物密封或金属结合组装
机译:石英谐振器与TSV中介层通过聚合物密封或金属结合组装