Cu plating on film substrate by UV surface reformation treatment technology

摘要

LCP (Liquid crystal polymer) is suitable for next flexible substrate generation for high speed transmission, and COP (Cyclo Olefin Polymer) has good material performance for RF products & medical healthcare application with very lower moisture absorption, lower ion contamination, good gas barrier, good transparence and lower protein adsorption with no fluorescing. But usually those LCP & COP materials are not suitable for Cu plating with previously conventional technologies. UV surface treatment technology can apply to Cu plating onto PI, LCP &COP flexible film substrate for keeping good adhesion force with nano-anchor approaching.