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Characterization of Parylene-C using quartz thickness shear mode (TSM) resonators

机译:使用石英厚度剪切模式(TSM)谐振器表征Parylene-C

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摘要

Due to its high sensitivity, repeatability and easy connection with electrical measurement systems, Quartz thickness-shear-mode (TSM) resonator is adopted to extract the complex shear modulus of Parylene-C films, which play an important role as both an effective wave-guiding layer and biocompatible interfacial layer in Shear-Horizontal Surface Acoustic Wave Device (SH-SAW, Love Mode). Parylene-C films of different thicknesses were deposited on the surface of AT-cut quartz TSM resonators, and admittance spectrums of these uncoated and coated TSM were measured by an impedance analyzer. Results indicated that the ideal thickness range for extraction was from 2.04 μm to 3.55 μm, effectively avoiding inadequate acoustic deformation as well as excessive electrical-response attenuation. The storage modulus G' and loss modulus G" of Parylene-C were 0.155±0.011 GPa and 4.78±0.44 GPa, respectively.
机译:由于它的高灵敏度,可重复性以及与电气测量系统的简便连接,因此采用石英厚度剪切模式(TSM)谐振器来提取Parylene-C薄膜的复数剪切模量,这在有效的波阻分析中起着重要的作用。水平表面声波装置(SH-SAW,Love模式)中的导流层和生物相容性界面层。将不同厚度的聚对二甲苯-C膜沉积在AT切割石英TSM谐振器的表面上,并通过阻抗分析仪测量这些未镀膜和镀膜TSM的导纳光谱。结果表明,提取的理想厚度范围为2.04μm至3.55μm,可有效避免声音变形不足以及过度的电响应衰减。聚对二甲苯-C的储能模量G'和损耗模量G”分别为0.155±0.011GPa和4.78±0.44GPa。

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