Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On Electronics Packaging

摘要

The problem of concurrent thermal and vibrationrnloading has not been thoroughly studied even though it isrncommon in electronic packaging applications. Here wernattempt to address such a problem using a damagernmechanics based constitutive model. Damage mechanicsrnconstitutive model for eutectic Pb/Sn solder alloys is used tornsimulate the damage effects of concurrent cyclic thermalrnloads and vibrations on electronics packages. The model isrnimplemented into the commercial finite element codernABAQUS through its user defined material subroutinerncapability. For the integration algorithm we have used arnreturn mapping scheme, which dramatically improves thernconvergence rate as compared to previous implementationsrnof the same model. Results are examined in terms ofrnaccumulation of plastic strain within the solder connections.rnIt is shown that the simplistic Miner's rule can notrnaccurately account for the combined effect of both loadingsrnacting concurrently.