A METHODOLOGY FOR EVALUATING THE MECHANICAL RELIABILITY OF ALTERNATIVES TO TIN-LEAD SOLDER ELECTRONIC INTERCONNECTION SYSTEMS (FOCUS ON ELECTRICALLY CONDUCTIVE ADHESIVES)

摘要

A methodology for evaluating suitable alternative materials to traditional tin-lead solder, as an electronic component interconnection media, is presented. This methodology was developed as part of prior research that addressed the mechanical reliability of alternative materials using approaches and methods, which were traditionally unique to tin-lead, solder. The original research included evaluation and subsequent tabulation of basic mechanical, fatigue, creep, and fracture mechanics properties. Basic mechanical data was acquired either through the literature or laboratory test. Fatigue data was limited to thermal shock/cycling. Creep data consisted of observing material behavior under temperature and thermo-mechanical loads. The fracture mechanics study features the validation and subsequent use of the J-Integral as applied to solder and electrically conductive adhesives (ECAs). This paper suggests a framework for establishing a methodology for evaluating mechanical reliability of electronic interconnection media based on the acquired materials data.