METHOD FOR PRODUCING COMPOSITE MATERIAL FOR SEMICONDUCTOR TEST SOCKET HAVING EXCELLENT HEAT DISSIPATION AND DURABILITY, AND COMPOSITE MATERIAL FOR SEMICONDUCTOR TEST SOCKET PRODUCED THEREBY

摘要

The present invention pertains to: a method for producing a composite material for a semiconductor test socket, the method comprising (a) a step for preparing a mixed powder including (i) a metal powder including a magnesium powder and an aluminum or aluminum alloy powder and (ii) a polymer powder, and (b) a step for preparing a composite material by performing spark plasma sintering (SPS) on the mixed powder prepared in step (a); a composite material that is for a semiconductor test socket and produced thereby; a method for manufacturing a semiconductor test socket, the method comprising a step for preparing an insulating part made of the composite material; and a semiconductor test socket manufactured thereby.