INK-JET APPLICATION TYPE COMPOSITION FOR WIRING-LINE PROTECTION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE

摘要

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which is applicable by ink-jet printing and can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration.　The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound having two or more epoxy groups in the molecule, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25°C and 20 rpm, of 5-50 mPa·s.