首页> 外国专利> METHOD FOR MANUFACTURING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE PROVIDED WITH HEAT-CONDUCTING LAYER

METHOD FOR MANUFACTURING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE PROVIDED WITH HEAT-CONDUCTING LAYER

机译:制造热导热材料,导热材料,导热片和具有导热层的装置的方法

摘要

The present invention provides a method for manufacturing a heat-conducting material, whereby a heat-conducting material having exceptional thermal conductivity can be obtained, using a heat-conducting-material-forming composition that has a reduced filler content. The present invention also provides a heat-conducting material, a heat-conducting sheet, and a device provided with a heat-conducting layer. This method for manufacturing a heat-conducting material comprises using a heat-conducting-material-forming composition including an epoxy compound and a phenol compound that includes a compound represented by general formula (P0), the ratio of the number of epoxy groups to the number of phenolic hydroxyl groups being 40/60 to 60/40, and the composition not including a filler, or the filler content being 10 mass% or less with respect to the total solid content when the composition includes a filler, wherein the method includes a pre-curing step and a main curing step.
机译:本发明提供了一种制造导热材料的方法,由此使用具有减少的填料含量的导热材料形成组合物,可以获得具有出不同导热率的导热材料。本发明还提供了一种导热材料,导热片和设置有导热层的装置。这种制造热导热材料的方法包括使用包括环氧化合物和酚化合物的热传导材料形成组合物,所述酚化合物包括通式(P0)表示的化合物,环氧基的数量与苯并基酚醛羟基的数量为40/60至60/40,并且当组合物包含填料时,填料不包括填料的组合物或填料含量相对于总固体含量为10质量%或更小,其中该方法包括预固化步骤和主要固化步骤。

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