method and device for cover of zuleitern and element existing electronic component with a pulverschicht

• 1. 用多个开关元件实现有载调压的方法和装置 [P] . 中国专利： CN101039091A . 2007-09-19
• 2. 覆盖有荧光体层的光半导体元件及其制造方法、光半导体装置及其制造方法 [P] . 中国专利： CN103811645A . 2014-05-21
• 3. method and device for cover of zuleitern and element existing electronic component with a pulverschicht [P] . 德国专利： DE2508595B2 . 1979-12-20

  机译： 的方法和装置覆盖铅锌合金和元件现有的电子零件

• 4. Electronic component assembly comprises a cover element which is placed onto a carrier body and is joined to it so that the electronic component is surrounded by the cover element [P] . 德国专利： DE10051472A1 . 2002-05-02

  机译： 电子元件组件包括盖元件，该盖元件被放置在载体上并与之连接，使得电子元件被该盖元件包围。

• 5. TEMPLATE, CARRIER WITH ELECTRONIC COMPONENTS TO BE COVERED, CARRIER WITH ELECTRONIC COMPONENTS COVERED, SAVED COVERED ELECTRONIC COMPONENT AND METHOD OF COVERING ELECTRONIC COMPONENTS. [P] . NL2010379C2 . 2014-09-03

  机译： 模板，要覆盖电子成分的载体，所覆盖电子成分的载体，保存的覆盖电子成分以及覆盖电子成分的方法。

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• 1. Forward Calculation of 2-D and 3-D Structures with a Cover by the Boundary Element Method while Using Electrical Methods [J] . Fu Liangkui Chen FujiDepartment of Geophysics China University of Geosciences Beijing 100083 . 地球科学学刊：英文版 . 1990,第1期
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