首页> 外国专利> DIAMOND GRINDING MATERIAL FOR METAL BOND GRINDING STONE

DIAMOND GRINDING MATERIAL FOR METAL BOND GRINDING STONE

机译:金属结合剂磨石用金刚石磨料

摘要

PURPOSE:To improve a holding force generated by means of the metal bond of grinding grains and to improve grinding characteristics, by a method wherein a diamondlike rigid carbon material layer is formed on a diamond grinding grain surface. CONSTITUTION:A diamondlike rigid carbon material layer is formed in a film thickness of approximate 2-5mum on a diamond grinding grain surface to provide a desired diamond grinding material for a metal bond grinding stone. By means of a diamond grinding material by which the carbon material layer is formed, adhesion between diamond grinding grains and a metal bond can be improved, and the frequency of peeling of the diamond grinding material during a grinding work can be decreased. Since a diamondlike carbon material layer itself is actioned as 8 grinding material, the grinding power of a metal bond grinding stone formed by a diamond grinding stone can be improved.
机译:目的:通过在金刚石磨粒表面上形成类金刚石硬质碳材料层的方法,提高由磨粒的金属键产生的保持力并改善磨削特性。组成:类金刚石硬质碳材料层形成在金刚石磨粒表面上的膜厚约为2-5μm,从而为金属结合剂磨石提供所需的金刚石磨料。通过形成碳材料层的金刚石磨削材料,可以改善金刚石磨削颗粒与金属结合物之间的粘附性,并且可以减少在磨削工作期间金刚石磨削材料的剥离频率。由于类金刚石碳材料层本身用作8种研磨材料,因此可以提高由金刚石磨石形成的金属结合剂磨石的研磨能力。

著录项

  • 公开/公告号JPH0197570A

    专利类型

  • 公开/公告日1989-04-17

    原文格式PDF

  • 申请/专利权人 NORITAKE DIA KK;

    申请/专利号JP19870253108

  • 申请日1987-10-06

  • 分类号B24D3/00;B24D3/06;C04B37/02;C09K3/14;

  • 国家 JP

  • 入库时间 2022-08-22 06:41:06

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号