DIAMOND BRIDGE OR DIAMOND CANTILEVER, THEIR MANUFACTURE AND ELECTRONIC DEVICE USING SUCH DIAMOND BRIDGE OR CANTILEVER

摘要

PURPOSE: To provide a diamond bridge, a diamond cantilever, a method for their manufacture, and a mass-producible electronic device using such a diamond bridge or cantilever, wherein favorable environment resistance, sufficient dimensional accuracy and strength are obtained, and wherein relatively simple manufacture is implemented. ;CONSTITUTION: A diamond film 3 is formed on a substrate 1 of silicon or the like. There is a gap 2 between the diamond film and the substrate, and the gap 2 is formed by forming the diamond film across the surface of the substrate and a sacrificial layer, temporarily formed, and then removing the sacrificial layer. Specifically, the gap between the diamond film and the substrate is formed as follows: An oxide film is formed on a substrate of silicon or the like. After the oxide film is scratched, a part of it is removed to expose the surface of the substrate. Resist is applied to the exposed surface and a part of the oxide film connecting to the exposed surface, which is to make a sacrificial layer. Ion is implanted, and the resist is stripped. A diamond film is formed there, and a sacrificial layer of the oxide film and the remaining oxide film are removed. Thus the gap is formed between the diamond film and the substrate.;COPYRIGHT: (C)1996,JPO