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Real time control of plasma etch utilizing multivariate statistical analysis
Real time control of plasma etch utilizing multivariate statistical analysis
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机译:利用多元统计分析实时控制等离子体蚀刻
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摘要
Hotelling's T.sup.2 statistical analysis and control is used to provide multivariate analysis of components of an RF spectra for real time, in-situ control of an ongoing semiconductor process. An algorithm calculates the T.sup.2 value which is then used to generate a feedback signal, if the T.sup.2 value is out of range, to indicate an out-of- tolerance condition.
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