LEAD MOLDING METHOD, LEAD MOLDING DEVICE, METHOD OF REMOVING FOREIGN MATTER FROM LEAD MOLDING DEVICE, LEAD CUTTER, METHOD OF ATTACHING OUTER LEAD, OUTER LEAD PROCESSOR, AND METHOD OF REMOVING FOREIGN MATTER FROM OUTER LEAD

摘要

PROBLEM TO BE SOLVED: To prevent the readhesion of solder plating rubbish to an outer lead. ;SOLUTION: An upper mold die set 11 goes down while compressing the spring 15b around a post 11, being pressed with a press (not shown in the figure) from its top. A cam 8 fixed to the die holder 5 of the upper mold die set 11 goes down while shifting a rotating roller 9 from inside to outside. Since a molding punch 7 is fixed to a punch holder 12 by a rotatable fixing pin 13, it performs closing motion while compressing the spring 15a, and the molding processing of the outer lead 3 of a semiconductor device 1 installed on a lead presser 14 is performed. The molding of the outer lead 3 of the semiconductor device 1 is executed upward, and solder plating rubbish, which is deposited and adheres to the molding punch 7 and a molding die 4 and then falls, is let fall downward, thus the readhesion to the outer lead 3 is avoided.;COPYRIGHT: (C)1997,JPO