RELIABILITY EVALUATING METHOD AND RELIABILITY EVALUATING DEVICE FOR MULTILAYER PRINTED WIRING BOARD AND PROBE FOR INTERLAYER RESISTANCE MEASUREMENT FOR MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a reliability evaluating method and a reliability evaluating device for a multilayer printed wiring board and a probe for interlayer resistance measurement for a multilayer wiring board, making it possible to make sure of a value of individual insulation resistance of each layer by a simple structure. SOLUTION: A plurality of electrodes L1 to L8 are exposedly provided on a top-layer board surface, respective patterns on plurally layered printed circuit boards including a printed circuit board Pw1 are connected to the electrodes L1 to L8 via through holes TH2 to TH8, respectively, and the electrodes L1 to L8 are connected in series with each other by exposed connection parts Cn12 to Cn78. By this method, when any of the respective connection parts is not cut off, all the patterns are connected with each other, and therefore, reliability evaluation of the whole is made at a stroke by measuring an insulation resistance value or continuity, and then, reliability evaluation between desired patterns is separately performed by measuring an insulation resistance value or continuity after a desired connection part is successively cut off.