首页> 外国专利> RAISED SOURCE/DRAIN SOI TRANSISTOR, AND CMOS DEVICE AND MANUFACTURING METHOD OF CMOS DEVICE USING ULTRA-THIN SOI(SILICON OVER INSULATOR) SUBSTRATE

RAISED SOURCE/DRAIN SOI TRANSISTOR, AND CMOS DEVICE AND MANUFACTURING METHOD OF CMOS DEVICE USING ULTRA-THIN SOI(SILICON OVER INSULATOR) SUBSTRATE

机译:升高的源/漏SOI晶体管,以及使用超薄SOI(绝缘体上硅)衬底的CMOS器件及其制造方法

摘要

PURPOSE: A raised source/drain SOI(Silicon Over Insulator) transistor, and a CMOS(Complementary Metal Oxide Semiconductor) device and a manufacturing method of CMOS device are provided to produce a CMOS device using an ultra-thin SOI substrate by forming a raised source/drain area using vaporization at a very low temperature. CONSTITUTION: A raised source/drain(RSD) SOI transistor includes a buried oxide(BOX) layer, an SOI wafer, a gate dielectric(25), a gate region on the gate dielectric, an implant layer(65), a source/drain region, and an STI(Shallow Trench Isolation) region(35). The SOI wafer is placed over the BOX layer. The gate dielectric is placed over the SOI wafer. The implant layer is adjacent to the SOI wafer and includes a vaporized material thereon. The source/drain region is placed on the implant layer and the SOI wafer. The STI region is adjacent to the source/drain region and has an upper surface that is higher than an upper surface of the gate dielectric.
机译:目的:提供一种凸起的源极/漏极绝缘体上硅(SOI)晶体管和CMOS(互补金属氧化物半导体)器件以及该CMOS器件的制造方法,以通过形成凸起来使用超薄SOI衬底来制造CMOS器件。在非常低的温度下使用蒸发来蒸发源/漏区。组成:凸起的源/漏(SOD)SOI晶体管包括:埋层氧化物(BOX)层,SOI晶片,栅极电介质(25),栅极电介质上的栅极区域,注入层(65),源极/漏极区和STI(浅沟槽隔离)区(35)。 SOI晶片放置在BOX层上方。栅极电介质放置在SOI晶圆上。注入层与SOI晶片相邻并且在其上包括汽化材料。源极/漏极区放置在注入层和SOI晶圆上。 STI区域与源极/漏极区域相邻,并且具有比栅极电介质的上表面高的上表面。

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