首页> 外国专利> METHOD FOR FABRICATING SINGLE CRYSTALLINE SILICON TFT-FRAM TO IMPROVE INTEGRATION AND EMBODY HIGH PERFORMANCE TFT-FRAM

METHOD FOR FABRICATING SINGLE CRYSTALLINE SILICON TFT-FRAM TO IMPROVE INTEGRATION AND EMBODY HIGH PERFORMANCE TFT-FRAM

机译:一种制造单晶硅TFT-FRAM以提高集成度和体现高性能TFT-FRAM的方法

摘要

PURPOSE: A method for fabricating a single crystalline silicon TFT-FRAM(thin film transistor-ferroelectric random access memory) to improve integration and achieve high performance TFT-FRAM, by bonding an implanted silicon wafer to a ferroelectric capacitor, by eliminating a splitting zone from the implanted silicon wafer and by forming a transistor in a single crystalline thin film silicon. CONSTITUTION: A ferroelectric capacitor array is formed. An implanted silicon wafer including a silicon thin film is bonded to the ferroelectric capacitor array so as to be connected to an upper electrode(13) of a ferroelectric capacitor. The rest of the implanted silicon wafer except the silicon thin film is eliminated. A transistor is formed on the silicon thin film.
机译:用途:一种制造单晶硅TFT-FRAM(薄膜晶体管-铁电随机存取存储器)以改善集成度并实现高性能TFT-FRAM的方法,该方法是通过将注入的硅片粘结到铁电电容器上而消除分裂区来实现的通过在单晶薄膜硅中形成晶体管,从注入的硅晶片中去除杂质。组成:铁电电容器阵列形成。将包括硅薄膜的注入的硅晶片键合到铁电电容器阵列,以便连接到铁电电容器的上电极(13)。除硅薄膜外,其余注入的硅晶片均被去除。在硅薄膜上形成晶体管。

著录项

  • 公开/公告号KR100450788B1

    专利类型

  • 公开/公告日2004-09-20

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR19970052115

  • 发明设计人 YOO IN GYEONG;

    申请日1997-10-10

  • 分类号H01L27/12;

  • 国家 KR

  • 入库时间 2022-08-21 22:46:37

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