首页> 外国专利> HYBRID INTEGRATED TYPE OPTICAL DEVICE, SILICON OPTICAL BENCH FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, PLANAR WAVEGUIDE DEVICE FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, FABRICATION METHOD OF HYBRID INTEGRATED TYPE OPTICAL DEVICE, AND OPTICAL AXES ALIGNING METHOD THEREFOR

HYBRID INTEGRATED TYPE OPTICAL DEVICE, SILICON OPTICAL BENCH FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, PLANAR WAVEGUIDE DEVICE FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, FABRICATION METHOD OF HYBRID INTEGRATED TYPE OPTICAL DEVICE, AND OPTICAL AXES ALIGNING METHOD THEREFOR

机译:混合型集成光学器件,用于混合型集成光学器件的硅光学平台,用于混合型集成光学器件的平面波导器件,混合型集成光学器件的制造方法以及光学器件

摘要

The constant regions corresponding metal pattern and the portion to be formed with a LD / PD for flip chip bonding with the planar optical waveguide device to a portion of the micro-heater after the formation of the micro-heater to the silicon substrate for flip chip bonding with the LD / PD together form a metal pattern, LD / PD of the flip-chip bonding to form a silicon optical bench. On the other hand, after planarizing the upper clad layer of the planar optical waveguide device is an optical fiber and a planar optical waveguide is formed passive alignment to form a metal pattern for flip-chip bonding of the silicon optical bench. When each of the metal pattern formed on a silicon optical bench with a planar optical waveguide device are arranged to face, the LD / PD, optical waveguides, optical fibers are arranged side by side. At this time, while operating the LD measures the amount of light emitting through an optical fiber active alignment a silicon optical bench with a planar optical waveguide device with, and a silicon optical bench with a planar optical waveguide device to provide power to the micro-heater flip chip bonding .
机译:恒定区域对应于金属图案,以及将要形成的用于与平面光波导器件倒装芯片接合的LD / PD的部分与LD / PD形成的部分,在将微型加热器形成到倒装芯片的硅基板之后,与微型加热器的一部分与LD / PD键合在一起形成金属图案,LD / PD的倒装键合形成硅光具座。另一方面,在平坦化平面光波导装置的上覆层之后,是光纤,并且将平面光波导形成为无源对准以形成用于倒装芯片结合硅光具座的金属图案。当形成在具有平面光波导装置的硅光具座上的每个金属图案面对时,LD / PD,光波导,光纤并排布置。此时,在操作LD时,将测量通过光纤主动对准,带有平面光波导装置的硅光具座和带有平面光波导装置的硅光具座的发光量,以向微型光纤供电。加热器倒装芯片粘接。

著录项

  • 公开/公告号KR20050070263A

    专利类型

  • 公开/公告日2005-07-07

    原文格式PDF

  • 申请/专利权人 MICROSOLUTIONS INC.;

    申请/专利号KR20030099555

  • 发明设计人 PARK SANG HEUM;KO YOUN IL;

    申请日2003-12-30

  • 分类号G02B6/30;

  • 国家 KR

  • 入库时间 2022-08-21 22:04:54

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