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HYBRID INTEGRATED TYPE OPTICAL DEVICE, SILICON OPTICAL BENCH FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, PLANAR WAVEGUIDE DEVICE FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, FABRICATION METHOD OF HYBRID INTEGRATED TYPE OPTICAL DEVICE, AND OPTICAL AXES ALIGNING METHOD THEREFOR
HYBRID INTEGRATED TYPE OPTICAL DEVICE, SILICON OPTICAL BENCH FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, PLANAR WAVEGUIDE DEVICE FOR HYBRID INTEGRATED TYPE OPTICAL DEVICE, FABRICATION METHOD OF HYBRID INTEGRATED TYPE OPTICAL DEVICE, AND OPTICAL AXES ALIGNING METHOD THEREFOR
The constant regions corresponding metal pattern and the portion to be formed with a LD / PD for flip chip bonding with the planar optical waveguide device to a portion of the micro-heater after the formation of the micro-heater to the silicon substrate for flip chip bonding with the LD / PD together form a metal pattern, LD / PD of the flip-chip bonding to form a silicon optical bench. On the other hand, after planarizing the upper clad layer of the planar optical waveguide device is an optical fiber and a planar optical waveguide is formed passive alignment to form a metal pattern for flip-chip bonding of the silicon optical bench. When each of the metal pattern formed on a silicon optical bench with a planar optical waveguide device are arranged to face, the LD / PD, optical waveguides, optical fibers are arranged side by side. At this time, while operating the LD measures the amount of light emitting through an optical fiber active alignment a silicon optical bench with a planar optical waveguide device with, and a silicon optical bench with a planar optical waveguide device to provide power to the micro-heater flip chip bonding .
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