METHOD FOR FORMING SINGLE AG-AU PLATING ON PRINTED CIRCUIT BOARD FOR HIGH DENSITY INTERCONNECTION, AND PRINTED CIRCUIT BOARD FOR HIGH DENSITY INTERCONNECTION HAVING SINGLE AG-AU PLATING

摘要

Method of forming single silver-gold plated layer for soldering and wire bonding in printed circuit board for High Density Interconnection and high density printing with single silver-gold plated layer produced by the method A circuit board is disclosed. The single silver-gold plating layer is formed by mixing a porous silver plating part made of silver or silver alloy and a gold plating part made of gold or gold alloy on a copper layer made of copper (Cu) or copper alloy (Cu-alloy) by a substitution plating method. Is made by. According to the present invention, it is possible to replace the conventional electroless nickel plating and electroless plating processes, thereby solving the problem of spreading plating in thin circuits having a thickness of 60 µm or less, and electroless nickel. And the black pad problem that occurs frequently during the surface mount technology of the electroless gold plated printed circuit board can be completely solved. In addition, in terms of economics, the process time can be shortened to less than one third compared to the conventional electroless nickel and electroless plating processes, and productivity can be greatly increased. Since peeling is possible, it is possible to produce a high density printed circuit board without defects.