Plasma-assisted treatment of given substrate surface area, e.g. for structurizing or coating metal, alloy, semiconductor, insulator or dielectric, uses insulator with opening, to form discharge gap, between electrode and substrate

摘要

Plasma-assisted treatment of predetermined surface areas of a substrate involves operating a gas discharge without dielectric barriers by applying a potential at 2 electrodes and placing an insulator between one electrode and either the substrate or an ancillary electrode, so that there is a discharge gap at the given area, formed by openings in the insulator and ancillary electrode. An independent claim is also included for equipment used for this type of treatment.